Heating Element Thermal Adhesive H-G3009 High Thermal Conductivity Bonding Fixed Edge RTV Silicone Rubber 120ml
H-G3009 Thermally Conductive Silicone 1.2 w/m·kOne. Product Introduction This
H-G3009 Thermally Conductive Silicone 1.2 w/m·kOne. Product Introduction This
H-G3009 Thermally Conductive Silicone 1.2 w/m·k
One. Product Introduction
This thermally conductive adhesive is a one-component paste with excellent operating performance and smooth extrusion, making it suitable for both machine and manual gluing. This product has a wide applicable temperature range (-60∽280ºC), no corrosion to a variety of metal and non-metallic materials, and has good adhesion performance, mainly used in electronic and electrical products with high thermal conductivity requirements, with excellent electrical properties and strong thermal conductivity function.
Two. Technical parameters
state | Inspection items | Test Standards | unit | Product test results |
solid change former | color | --- | --- | Light off-white |
viscosity | GB/T 10247-2008 | 25ºC，mPa· S | Paste | |
density | GB/T 13354-92 | 25ºC，g/cm3 | 2.10±0.05 | |
Surface drying time | GB/T134775-2002 | 25ºC,RH：50%,min | 5~15 | |
solid change after | hardness | GB/T 531.1-2008 | Shore A | 60~75 |
thermal conductivity | GB/T 10297-1998 | w/m·k | ≧1.20 | |
Expansion coefficient | GB/T 20673-2006 | µm/(m,ºC) | 180 | |
Water absorption | GB/T 8810-2005 | 24h,25ºC,% | 0.01~0.02 | |
Tear off the elongation | GB/T 528-1998 | % | ≥50 | |
tensile strength | GB/T 528-1998 | MPa | ≥1.5 | |
Shear strength | GB 6328-86 | Mpa-Aluminum/Aluminum | ≥1.2 | |
Dielectric strength | GB/T 1693-2007 | Kv/mm(25ºC) | ≥18 | |
Volumetric resistance | GB/T 1692-92 | （DC500V）,Ω· cm | 1.5×1016 |
Note: The above products are tested after 7 days of curing under the conditions of temperature 25ºC and relative humidity of 50±5%.
Three. How to use:
1.Substrate cleaning: remove oil, dust, rust, etc., so that the sizing surface is clean and dry.
2.Sizing: Apply the adhesive to the sizing part of the corresponding substrate manually or using dispensing equipment.
3.Curing: This product is a moisture-curing material, its surface drying and curing speed depends on the relative humidity of the material use environment, temperature and the thickness of sizing (2mm), generally cured under the conditions of 25ºC, RH: 50~60% for 24-72 hours before it can be put into use, and the best design performance is achieved after 7 days.
4.Precautions: The unused glue should be tightened immediately after opening, sealed and stored, and when used again, if there is a little crust at the seal, it can be used after removal, without affecting the performance of the colloid.
Four. packaging, storage and transportation, and shelf life
1.Packaging: 120ml (100 bottles/box), 300ml/bottle (25 bottles/box).
2.Storage and transportation: This product is a non-toxic and non-dangerous product, transported according to general chemicals, and stored in a cool (room temperature) dry place.
3.Shelf life: 6 months (below 23ºC indoors).
