Silicone Thermal Conductive Glue H-G3009 Electronic Components Fixed Thermal Conductive Glue 300ml
H-G3009 One-component room temperature thermally conductive siliconeOne. Produc
H-G3009 One-component room temperature thermally conductive siliconeOne. Produc
H-G3009 One-component room temperature thermally conductive silicone
One. Product Introduction
This thermally conductive adhesive is a one-component paste with excellent operating performance and smooth extrusion, making it suitable for both machine and manual gluing. This product has a wide applicable temperature range (-60∽280ºC), no corrosion to a variety of metal and non-metallic materials, and has good adhesion performance, mainly used in electronic and electrical products with high thermal conductivity requirements, with excellent electrical properties and strong thermal conductivity function.
Two. Technical parameters
state | Inspection items | Test Standards | unit | Product test results |
solid change former | color | --- | --- | Light off-white |
viscosity | GB/T 10247-2008 | 25ºC，mPa· S | Paste | |
density | GB/T 13354-92 | 25ºC，g/cm3 | 2.10±0.05 | |
Surface drying time | GB/T134775-2002 | 25ºC,RH：50%,min | 5~15 | |
solid change after | hardness | GB/T 531.1-2008 | Shore A | 60~75 |
thermal conductivity | GB/T 10297-1998 | w/m·k | ≧1.20 | |
Expansion coefficient | GB/T 20673-2006 | µm/(m,ºC) | 180 | |
Water absorption | GB/T 8810-2005 | 24h,25ºC,% | 0.01~0.02 | |
Tear off the elongation | GB/T 528-1998 | % | ≥50 | |
tensile strength | GB/T 528-1998 | MPa | ≥1.5 | |
Shear strength | GB 6328-86 | Mpa-Aluminum/Aluminum | ≥1.2 | |
Dielectric strength | GB/T 1693-2007 | Kv/mm(25ºC) | ≥18 | |
Volumetric resistance | GB/T 1692-92 | （DC500V）,Ω· cm | 1.5×1016 |
Note: The above products are tested after 7 days of curing under the conditions of temperature 25ºC and relative humidity of 50±5%.
Three. How to use:
1.Substrate cleaning: remove oil, dust, rust, etc., so that the sizing surface is clean and dry.
2.Sizing: DB929 can be applied to the sizing site of the corresponding substrate manually or using dispensing equipment.
3.Curing: This product is a moisture-curing material, its surface drying and curing speed depends on the relative humidity of the material use environment, temperature and sizing thickness (2mm), generally under the condition of 25ºC, RH: 50~60% curing can be put into use for 24 hours, and the best design performance is achieved after 7 days.
4.Precautions: The unused glue should be tightened immediately after opening, sealed and stored, and when used again, if there is a little crust at the seal, it can be used after removal, without affecting the performance of the colloid.
Four. packaging, storage and transportation, and shelf life
1.Packaging: 120ml/pc (100 pcs/carton); 300ml/bottle (25 bottles/box).
2.Storage and transportation: This product is a non-toxic and non-dangerous product, transported according to general chemicals, and stored in a cool (room temperature) dry place.
3.Shelf life: 6 months (below 23ºC).
